Category | ||
---|---|---|
Manufacturer | Harimatec | |
Series |
HF212
|
|
Packaging |
Bulk
|
|
Part Status | Obsolete | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Type | Solder Paste | |
Melting Point | 423°F (217°C) | |
Form | Jar, 17.64 oz (500g) | |
Process | Lead Free | |
Flux Type | No-Clean | |
Shelf Life Start | Date of Manufacture | |
Shelf Life | 6 Months |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | 1769646 | |
Datasheets | Multicore HF212 Brochure | |
Datasheets | High Reliability PB-Free Solder Alloy | |
MSDS Material Safety Datasheet | 1769646 SDS | |
PCN Obsolescence/ EOL | Closing of Sale of Henkel’s Solder Material Business 06/MAY/2022 | |
PCN Packaging | Henkel/Berquist Revised Brands 10/May/2016 | |
HTML Datasheet | HF 212 | |
Manuals | HF212 Solder Paste Engineering Manual |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 8311.30.3000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
RoHS Status | RoHS non-compliant |