Category | ||
---|---|---|
Manufacturer | Harimatec | |
Series |
LF318
|
|
Packaging |
Bulk
|
|
Part Status | Active | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Type | Solder Paste | |
Melting Point | 423°F (217°C) | |
Form | Cartridge, 21.16 oz (600g) | |
Mesh Type | 3 | |
Process | Lead Free | |
Flux Type | No-Clean | |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) | |
Shelf Life Start | Date of Manufacture | |
Shelf Life | 6 Months |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | 721471 | |
PCN Obsolescence/ EOL | Closing of Sale of Henkel’s Solder Material Business 06/MAY/2022 |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 8311.90.0000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
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