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SMDSWLF.006 1G

Part Number
SMDSWLF.006 1G
Manufacturer Chip Quik, Inc.
Other Part Numbers
315-SMDSWLF.0061G-ND
315-SMDSWLF.0061G
Description SOLDER WIRE SN96.5/AG3/CU0.5
Detailed Description Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g)
Manufacturer Standard Lead Time 4 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
Packaging
Bulk
Part Status Active
Diameter 0.006" (0.15mm)
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type Wire Solder
Melting Point 423 ~ 428°F (217 ~ 220°C)
Form Spool, 0.035 oz (1g)
Process Lead Free
Flux Type No-Clean, Water Soluble

Documents & Media

RESOURCE TYPE LINK
Datasheets SMDSWLF.006 1G

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 8311.30.6000
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 6

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