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THGAMVG9T23BAIL

Part Number
THGAMVG9T23BAIL
Manufacturer Toshiba Memory America, Inc. (Kioxia America, Inc.)
Other Part Numbers
1853-THGAMVG9T23BAIL-ND
1853-THGAMVG9T23BAIL
Description IC FLASH 512GBIT EMMC 153FBGA
Detailed Description FLASH - NAND Memory IC 512Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)

Product Attributes

Category
Manufacturer Toshiba Memory America, Inc. (Kioxia America, Inc.)
Series
Packaging
Tray
Part Status Last Time Buy
Package / Case 153-WBGA
Mounting Type Surface Mount
Memory Size 512Gbit
Memory Type Non-Volatile
Operating Temperature -20°C ~ 85°C (TC)
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NAND
Clock Frequency 200 MHz
Memory Format FLASH
Supplier Device Package 153-BGA (11.5x13)
Memory Interface eMMC_5.1
Memory Organization 64G x 8
DigiKey Programmable Not Verified

Documents & Media

RESOURCE TYPE LINK
PCN Obsolescence/ EOL EOL 20/Mar/2024

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN 3A991B1A
HTSUS 8542.32.0071
Moisture Sensitivity Level (MSL) 3 (168 Hours)

In Stock: 50

Can ship immediately.
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