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IC Sockets

Mfr Part #	Quantity	Price	Series	Package	Product Status	Features	Mounting Type	Type	Operating Temperature	Number of Positions or Pins (Grid)	Termination	Material Flammability Rating	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination Post Length	Contact Resistance	Current Rating (Amps)
115-93-640-41-003000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Datasheet	136 In Stock	Active	115	Tube	Active	Open Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 125°C	40 (2 x 20)	Solder	-	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	0.108" (2.74mm)	-	3 A
32-C182-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics, Inc. Datasheet	13 In Stock	Active	EJECT-A-DIP™	Bulk	Active	Closed Frame	Through Hole	DIP, 0.6" (15.24mm) Row Spacing	-55°C ~ 105°C	32 (2 x 16)	Solder	UL94 V-0	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	0.125" (3.18mm)	-	3 A
108493-0015 DDR Socket, 96 BGA 7.5 mm x 13.1 Ironwood Electronics Datasheet	32 Marketplace	Active	Grypper	Bag	Active	-	-	BGA	-	96 (9 x 16)	Solder	-	-	0.031" (0.80mm)	-	-	-	-	-	-	-	-	-	-
4-1437536-1 524-AG11D-ES=SOCKET ASSEMBLY TE Connectivity AMP Connectors Datasheet	81 Marketplace	Active		Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
473370001 8.50 BY 8.50MM CAMERA SOCKET, 4. Molex Datasheet	3,207 Marketplace	Active		Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICM-328-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech Datasheet	662 In Stock	Active	ICM	Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-40°C ~ 105°C	28 (2 x 14)	Solder	UL94 V-0	Polyphenylene Sulfide (PPS)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Tin	-	Beryllium Copper	0.110" (2.78mm)	4mOhm	3 A
PLCC-52-AT PLCC 52P THROUGH HOLE Adam Tech Datasheet	32 In Stock	Active	PLCC	Tube	Active	Closed Frame	Through Hole	PLCC	-55°C ~ 105°C	52 (4 x 13)	Solder	UL94 V-0	Polybutylene Terephthalate (PBT), Glass Filled	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	0.126" (3.20mm)	30mOhm	1 A
1-2324271-6 LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors Datasheet	172 In Stock	Active		Tray	Active	Open Frame	Surface Mount	LGA 4189	-25°C ~ 100°C	2092	Solder	UL94 V-0	Thermoplastic	0.039" (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	0.034" (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	-	-	0.5 A
110-47-320-41-605000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Datasheet	67 In Stock	Active	110	Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 125°C	20 (2 x 10)	Solder	-	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	0.125" (3.18mm)	-	3 A
115-47-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Datasheet	67 In Stock	Active	115	Tube	Active	Open Frame	Through Hole	DIP, 0.3" (7.62mm) Row Spacing	-55°C ~ 125°C	20 (2 x 10)	Solder	-	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	0.108" (2.74mm)	-	3 A

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