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Socket Adapters
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Number of Pins
Mounting Type
Convert From (Adapter End)
Convert To (Adapter End)
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Material Flammability Rating
Housing Material
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Pitch - Post
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Contact Material - Post
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270 Results
Mfr Part # Quantity Price Series Package Product Status Features Number of Pins Mounting Type Convert From (Adapter End) Convert To (Adapter End) Operating Temperature Termination Material Flammability Rating Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Board Material Current Rating (Amps)
1106396-24
1106396-24
SOCKET ADAPTER DIP TO 24DIP 0.6
Aries Electronics, Inc.
90
In Stock
Active
Correct-A-Chip® 1106396
Bulk
Active
 - 24 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.130" (3.30mm) - 3 A
220-3342-19-0602J
220-3342-19-0602J
RECEPTACLE DIP SOCKET 20POS .3"
3M
75
In Stock
Active
Textool™
Box
Active
 Closed Frame 20 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
228-1277-19-0602J
228-1277-19-0602J
RECEPTACLE DIP SOCKET 28POS .6"
3M
50
In Stock
Active
Textool™
Box
Active
 - 28 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper - - 1 A
264-4493-19-0602J
264-4493-19-0602J
RECEPTACLE DIP SOCKET 64POS .9"
3M
12
In Stock
Active
Textool™
Box
Active
 - 64 Through Hole DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
28-653000-10
28-653000-10
SOCKET ADAPTER PLCC TO 28DIP 0.6
Aries Electronics, Inc.
54
In Stock
Active
Correct-A-Chip® 653000
Bulk
Active
 Socket Included 28 Through Hole PLCC DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 - 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass 1 A
218-3341-19-0602J
218-3341-19-0602J
RECEPTACLE DIP SOCKET 18POS .3"
3M
37
In Stock
Active
Textool™
Box
Active
 Closed Frame 18 Through Hole DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
222-3343-09-0602J
222-3343-09-0602J
SOCKET ADAPTER 22DIP TO 22DIP
3M
47
In Stock
Active
Textool™
Tube
Active
 - 22 Through Hole DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) - 1 A
32-653000-10
32-653000-10
SOCKET ADAPTER PLCC TO 32DIP 0.6
Aries Electronics, Inc.
17
In Stock
Active
Correct-A-Chip® 653000
Bulk
Active
 Socket Included 32 Through Hole PLCC DIP, 0.6" (15.24mm) Row Spacing - Solder UL94 V-0 - 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass 1 A
232-1285-19-0602J
232-1285-19-0602J
RECEPTACLE DIP SOCKET 32POS .6"
3M
18
In Stock
Active
Textool™
Tube
Active
 Closed Frame 32 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) - 1 A
232-1285-29-0602J
232-1285-29-0602J
RECEPTACLE DIP SOCKET 32POS .6"
3M
37
In Stock
Active
Textool™
Box
Active
 Closed Frame 32 Through Hole DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing -55°C ~ 125°C Solder UL94 V-0 Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) - 1 A