Menu

ACA-SPI-006-K01

Part Number
ACA-SPI-006-K01
Manufacturer LOTES
Other Part Numbers
3126-ACA-SPI-006-K01TR-ND
3126-ACA-SPI-006-K01TR
Description SPI 16 PIN_IC 300mil
Detailed Description 16 (2 x 8) Pos SOIC Socket Gold Surface Mount
Datasheet Datasheet

Product Attributes

Category
Manufacturer LOTES
Series
Packaging
Tape & Reel (TR)
Part Status Active
Features Board Guide, Closed Frame
Mounting Type Surface Mount
Type SOIC
Number of Positions or Pins (Grid) 16 (2 x 8)
Termination Solder
Material Flammability Rating UL94 V-0
Housing Material Liquid Crystal Polymer (LCP)
Pitch - Mating 0.050" (1.27mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 1.00µin (0.025µm)
Contact Material - Mating Phosphor Bronze
Pitch - Post 0.050" (1.27mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 1.00µin (0.025µm)
Contact Material - Post Phosphor Bronze
Contact Resistance 30mOhm

Documents & Media

RESOURCE TYPE LINK
Datasheets ACA-SPI-006-K01

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 8536.69.8000
RoHS Status ROHS3 Compliant

Available To Order

PACKAGING QUANTITY UNIT PRICE EXT PRICE
{{ p.name }} {{ numberFormat(p.buyQty) }} {{ priceFormat(p.unitPrice) }} {{ priceFormat(p.totalPrice) }}
Total Amount: {{ priceFormat(quotes.total) }} (including {{ priceFormat(quotes.fee) }} fee)

{{ package.name }}

QUANTITY UNIT PRICE EXT PRICE
{{ numberFormat(price.break_quantity) }} {{ priceFormat(price.unit_price) }} {{ priceFormat(price.break_quantity * price.unit_price) }}
Detailed pricing is currently unavailable.
Detailed packaging information is temporarily unavailable.
1